AMD 12nm Ryzen 2 CPUs To Release With High-Quality Soldered IHS For Improved Cooling
Ryzen second gen 2000 series with 12nm CPU strength is likely to be out by AMD in the next couple of months. They are said to feature GlobalFoundries’ all-new 12nm+ manufacturing process and enhanced Zen+ CPU cores. An official release in April has been confirmed for the rollout of Ryzen 2000 series CPUs, so far.
The new chips in AMD Ryzen 2000 series CPUs will have some great new integrations for users. Higher clock speeds, configurations of up to 8 cores and 16 threads. Users can expect significantly faster DDR4 RAM kits of up to 4000MHz.
James Prior, senior technical marketing CPU lead in AMD, revealed similarity in the features of 2000G series Raven Ridge Ryzen APU and the upcoming Pinnacle Ridge Ryzen 2000 series CPUs. However, one distinctive feature of the Ryzen 2000 series CPUs will be the integration of a high-quality Indium and Gold solder. This type of soldiers is reportedly well known for temperature reduction by up to 25c, in comparison to standard TIM solution. TIM is basically a thermal interface material notorious for cooling issues, which are relatively less expensive than high-quality Indium and Gold solder. Thus, this time, AMD has decided to make use of the high-quality solder for its high-end 2nd generation CPU parts.
In a bid to counter Intel’s market presence, AMD is ready for the above-said rollout plus has readied a strategic plan for the second half. By the second half of 2018, AMD is likely to launch its promised 2nd gen Threadripper too. Additionally, users with Ryzen 3, 5 and 7 models shouldn’t worry. As the new chipset X470 with the second gen Ryzen, 2000 series CPUs will be compatible with old models.
With such product plans lined up ahead for the year, do you think AMD can pose a tough contender for Intel? Leave your comments in the section below.